Press Releases

Honeywell Technology Is Helping To Keep Phones Cool

As smartphone usage grows, Honeywell’s solutions help designers optimize user experience across devices MORRIS PLAINS, N.J., March 7, 2017 – Honeywell (NYSE: HON) announced today the availability of a Thermal...

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Honeywell Announces New Ptm6000 Advanced Thermal Management Material For Semiconductor Manufacturing Applications

Contact: Lance Chapman 408-962-2098 lance.chapman@honeywell.com Technology helps devices stay cool, perform better MORRIS PLAINS, N.J., Oct. 1, 2015 -- Honeywell (NYSE: HON) Electronic Materials announced the...

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Honeywell’s Advanced Thermal Management Materials Now Being Used For Computer Graphics Display Systems

Technology helps Video Graphic Array (VGA) Cards Stay Cool, Perform Better CHANDLER, Ariz., Feb. 24, 2015 -- Honeywell (NYSE: HON) Electronic Materials announced today that its advanced Thermal Interface Materials...

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Honeywell’s Advanced Materials Help Mobile Devices Dissipate Heat To Perform Better

CHANDLER, Ariz., Sept. 25, 2014 -- Honeywell (NYSE: HON) Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and...

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Honeywell Electronic Materials Completes Capacity Increases For Copper And Tin Refining And Casting

SPOKANE, Wash., June 11, 2014 -- Honeywell (NYSE: HON) Electronic Materials announced today that it has completed an increase of its refining and casting capacity for high-purity copper and tin at its Spokane, Wash.,...

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Honeywell Electronic Materials Receives Continuous Improvement Award From Samsung Austin Semiconductor (SAS)

MORRIS TOWNSHIP, N.J., May. 21, 2014 – Honeywell (NYSE: HON) Electronic Materials announced today that it has received the Samsung Continuous Improvement Award (SCIA) from Samsung Austin Semiconductor (SAS),...

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Honeywell Electronic Materials Introduces New ECAE® Copper Manganese Sputtering Targets For Semiconductor Manufacturing

MORRIS TOWNSHIP, N.J., Feb. 14, 2014 – Honeywell (NYSE: HON) announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering...

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Honeywell Introduces New RadLo™ Low Alpha Plating Anodes For Semicondeuctor Packaging Applications

MORRIS TOWNSHIP, N.J., Feb. 14, 2014 – Honeywell (NYSE: HON) announced today that it has introduced new RadLo™ low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that...

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HONEYWELL ELECTRONIC MATERIALS SELECTED FOR THERMAL MANAGEMENT OF NEW GAMING PLATFORM

MORRIS TOWNSHIP, N.J., Dec. 13, 2013 – Honeywell (NYSE: HON) announced today that its PTM series of thermal interface materials (TIM) has been selected as the thermal management solution for a leading gaming...

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HONEYWELL INTRODUCES NEW RADLO™ LOW ALPHA MATERIALS FOR SEMICONDUCTOR PACKAGING APPLICATIONS

CHANDLER, Ariz., Sept. 12, 2012 -- Honeywell (NYSE: HON) Electronic Materials announced today it has introduced a new advanced offering in its RadLo™ low alpha materials product line, which is designed to reduce alpha...

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