Press Releases


Press Releases

10 Articles
October 01, 2015

Honeywell Announces New Ptm6000 Advanced Thermal Management Material For Semiconductor Manufacturing Applications

Contact: Lance Chapman 408-962-2098 lance.chapman@honeywell.com Technology helps devices stay cool, perform better MORRIS PLAINS, N.J., Oct. 1, 2015 — Honeywell (NYSE: HON) Electronic Materials announced the availability of its new Honeywell PTM6000 Phase Change Material (PCM). PTM6000 »

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February 24, 2015

Honeywell’s Advanced Thermal Management Materials Now Being Used For Computer Graphics Display Systems

Technology helps Video Graphic Array (VGA) Cards Stay Cool, Perform Better CHANDLER, Ariz., Feb. 24, 2015 — Honeywell (NYSE: HON) Electronic Materials announced today that its advanced Thermal Interface Materials (TIMs) are being integrated into the production »

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September 25, 2014

Honeywell’s Advanced Materials Help Mobile Devices Dissipate Heat To Perform Better

CHANDLER, Ariz., Sept. 25, 2014 — Honeywell (NYSE: HON) Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better. Leading mobile electronics »

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June 11, 2014

Honeywell Electronic Materials Completes Capacity Increases For Copper And Tin Refining And Casting

SPOKANE, Wash., June 11, 2014 — Honeywell (NYSE: HON) Electronic Materials announced today that it has completed an increase of its refining and casting capacity for high-purity copper and tin at its Spokane, Wash., facility. The project, »

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May 21, 2014

Honeywell Electronic Materials Receives Continuous Improvement Award From Samsung Austin Semiconductor (SAS)

MORRIS TOWNSHIP, N.J., May. 21, 2014 – Honeywell (NYSE: HON) Electronic Materials announced today that it has received the Samsung Continuous Improvement Award (SCIA) from Samsung Austin Semiconductor (SAS), recognizing Honeywell for excellence in quality, materials technology »

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February 14, 2014

Honeywell Introduces New RadLo™ Low Alpha Plating Anodes For Semicondeuctor Packaging Applications

MORRIS TOWNSHIP, N.J., Feb. 14, 2014 – Honeywell (NYSE: HON) announced today that it has introduced new RadLo™ low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data »

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February 14, 2014

Honeywell Electronic Materials Introduces New ECAE® Copper Manganese Sputtering Targets For Semiconductor Manufacturing

MORRIS TOWNSHIP, N.J., Feb. 14, 2014 – Honeywell (NYSE: HON) announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better »

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December 13, 2013

HONEYWELL ELECTRONIC MATERIALS SELECTED FOR THERMAL MANAGEMENT OF NEW GAMING PLATFORM

MORRIS TOWNSHIP, N.J., Dec. 13, 2013 – Honeywell (NYSE: HON) announced today that its PTM series of thermal interface materials (TIM) has been selected as the thermal management solution for a leading gaming platform. The material is »

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September 12, 2012

HONEYWELL INTRODUCES NEW RADLO™ LOW ALPHA MATERIALS FOR SEMICONDUCTOR PACKAGING APPLICATIONS

CHANDLER, Ariz., Sept. 12, 2012 — Honeywell (NYSE: HON) Electronic Materials announced today it has introduced a new advanced offering in its RadLo™ low alpha materials product line, which is designed to reduce alpha particle emissions that »

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July 25, 2012

Honeywell Receives Supplier Excellence Award From Infineon Technologies

CHANDLER, Ariz., July 25,  2012 — Honeywell (NYSE: HON) today announced that its Electronic Materials business has been awarded a Supplier Excellence Award from Infineon Technologies AG, Europe’s leading manufacturer of innovative semiconductor solutions for energy efficiency, »

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