Keep Cool – Perform Better

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Thermal Interface Materials

Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership. TIMs portfolio is designed to meet the critical needs of electronics industry.


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