Thermal Interface Solutions

As an advanced materials supplier, Honeywell has been meeting the application needs of electronic device manufacturers for more than 50 years, and we continue to provide vital materials for thermal management solutions across multiple industries.

  • Phase Change Material
  • Thermal Gap Pads
  • Thermal Putty Pads
  • Thermal Insulators
  • Thermal Grease
  • Thermal One-Part Hybrid
  • Thermal Two-Part Hybrid

Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bondline and high reliability without pump-out issues.

TYPICAL APPLICATIONS

  • Power control unit, inverter, onboard electronics
  • IGBT
  • Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
  • Switches, routers, base stations
  • Tablets, gaming, notebooks, smartphones, action cameras
  • Lighting

FEATURES

  • High performance filler and polymer technology
  • Phase change at 45˚C
  • Highly conductive filler loading to optimize performance
  • Superior handling and reworkability
  • Superior reliable thermal performance
  • Range of thermal properties to fit different needs

High Compressibility Gap Filler
Honeywell Thermal Gap Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.

TYPICAL APPLICATIONS

  • Consumer electronics
  • Telecommunications & network servers
  • Automotive electronics
  • Power devices & modules
  • Semiconductor logic & memory

FEATURES

  • High thermal performance
  • Ultra-high compressibility for low stress applications
  • Excellent surface wetting for low contact resistance
  • High reliability
  • Electrically insulating


High Thermal Conductivity | High Compressibility Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.

TYPICAL APPLICATIONS

  • EV battery & charging station
  • Automotive electronics
  • Power devices & modules
  • Telecommunications & network servers

FEATURES

  • High thermal performance
  • Ultra-soft
  • High compressibility
  • Excellent gap-filling capability
  • Naturally tacky

The TIP series is Honeywell’s latest high-performance thermal conductivity and insulation material. It is made with silicon resin as the matrix, reinforced with glass fibers as the substrate.

TYPICAL APPLICATIONS

  • Automotive electronics
  • Power conversion equipment
  • Power supply equipment
  • Motor controllers
  • Speaker amplifier
  • Power switch

FEATURES

  • High thermal performance
  • High breakdown voltage
  • Good resistance to tears, cut-throughs and punctures
  • Single side PSA available for easy assembly

High Thermal Conductivity Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.

TYPICAL APPLICATIONS

  • CPU, GPU and chipsets
  • LED assemblies
  • Automotive electronics
  • IGBT & power units
  • Flipchip BGAs
  • Range of thermal properties to fit different needs

FEATURES

  • Low viscosity and excellent thixotropy for dispensing or stencil/screen printing
  • Range of BLT thicknesses
  • Thermal resistance and thermal conductivity options for different power densities
  • High stability and reliability
  • Stable and homogeneous at room temperature storage
  • Range of thermal properties to fit different needs

One-Part Dispensable
Very Low Compression Force
Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.

TYPICAL APPLICATIONS

  • Consumer electronics
  • Telecommunications equipment
  • Automotive electronics
  • Power supplies & semiconductors
  • Memory & power modules
  • Power electronics

FEATURES

  • High thermal performance and low contact resistance
  • Easily dispensable and reworkable
  • High compressibility for low stress applications
  • Long-term reliability
  • No pump-out or cracking risk
  • Reduced oil separation
  • Requires no mixing, additional curing or low temperature storage

Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.

TYPICAL APPLICATIONS

  • Consumer electronics
  • Telecommunications equipment
  • Automotive electronics
  • Memory & power modules

FEATURES

  • Low contact resistance
  • Easily to dispense and rework
  • High compressibility for low stress applications
  • Long-term reliability
  • Reduced oil separation
  • No pump-out and cracking