Thermal management

MEETING YOUR CHALLENGES

Our extensive thermal interface material portfolio is designed to support your varying thermal needs across a broad range of applications. Gaming platforms and tablets experience sudden temperature spikes and require very high thermal performance, while power electronics in automobiles need extreme thermal stability to meet warranties. Honeywell’s innovative solutions, R&D capabilities and extensive experience mean that your challenges are covered…now and in the future.

  • Our Approach
  • Your Requirements
  • Expertise and Capabilities
  • Industry Presentations

Honeywell’s thermal interface approach is based on phase change materials (PCMs). Our PCM design is driven by an innovative polymer technology and advanced filler systems that can be customized to fit diverse product applications and end uses. That means you get precisely what you need, when you need it.

Honeywell TIM products are designed to optimize thermal impedance. This means that we look at the entire thermal path, not just the TIM itself, including:

  • material interfaces,
  • thermal expansion of the joining interfaces
  • contact resistance
  • bond line thicknesses

Your Requirements

Thermal Interface Materials dissipate heat as quickly and effectively as possible from a device. But not all devices are the same.

Product use, product life cycle, packaging design, and operating conditions drive your TIM requirements. as well as these considerations:

Thermal Performance

Increasing power densities are raising device temperatures — requiring more effective TIM solutions that must deliver low thermal imped­ance and high bulk conductivity.

Product Life Cycle & Reliability

Mobile products like tablets and smart­phones have a short product life, but still require thermal management to protect from extreme and sudden bursts of energy and temperature spikes.

Conversely, automotive, power and server products must remain robust for significantly longer product life cycles.

The key requirement in these applications is not just immediate performance but also sustained, long-term thermal stability.

Gaps & Bond Line Thickness

IC designers are continually looking for ways to achieve more processing power in less space. It’s important for today’s TIMs to provide effective thermal management in increasingly constrained environments and different assembly designs.

Honeywell has the most complete line of innovative thermal interface materials (TIMs) available today.

For over half a century, Honeywell has been a key supplier to the worldwide electronics industry, providing critical materials to enhance the performance and reliability of our customers’ products. We employ approximately 1200 people across the United States, Europe and Asia.

Our three major R&D centers are located in California, Washington and China, and we hold nearly 400 granted and pending patents. Continuous investment in advanced research, worldwide strategic collaborations, and dedication to working closely with our customers has resulted in a wide-ranging product portfolio.

TIM Materials Targeted To Meet Your Challenges

Our thermal interface material product portfolio supports varying thermal needs across a broad range of applications. Gaming platforms and tablets experi­ence sudden temperature spikes and require very high thermal performance, while power electronics in automobiles _need extreme thermal stability to meet warranties that stretch over long lifetimes. Honeywell’s innovative solutions, R&D capabilities and extensive experience mean that your challenges are covered…now and in the future.

Take a look at the latest industry presentations delivered by Honeywell Electronic Materials:

Forum: Electric & Hybrid Vehicle Technology Conference / Battery Show – September 2016 event
Title: Thermal Interface Materials in Power Electronics
Description: Honeywell joined a technical panel to discuss advanced thermal management materials at a recent automotive industry event.
Download pdf

Forum: Luminus LED Workshop – April 2016 event
Title: Phase Change TIM Application in LED
Description: Honeywell attended the recent Luminus LED workshop. We delivered a presentation on phase change thermal interface materials and their beneficial use for the manufacture of LED devices. We discussed thermal trends, phase change thermal interface materials and the latest data for its application in the LED industry.

Forum: SEMI-THERM – March 2016 event
Title: High Performance SSD Memory Application with Compressible TIM Based on Phase Change Technology
Description: This presentation was developed jointly by Micron Technology and Honeywell. It focuses on high performance SSD Memory application with compressible Thermal Interface Material (TIM), based on Phase Change Technology. We also present thermal management industry trends, requirements and test criteria.

Forum: Thermal Live – October 2015 online event / webinar
Title: Thermal Management Challenges, Requirements, and Solutions for the Electronics Industry
Description: Honeywell joined a webinar during Thermal Live to discuss the key thermal properties involved in TIM decision-making, the challenging thermal requirements of key applications, a comparison of solutions available to the marketplace, and the promise of next-generation Phase Change Materials (PCMs) designed to meet the constantly changing demands of the electronics industry.
Download pdf

Forum: Thermal News – summer 2015 publication
Title: Meeting the Thermal Management Needs of Evolving Electronics Applications
Description: This article addresses the key thermal properties involved in TIM decision-making, the challenging thermal requirements of key applications, a comparison of solutions available to the marketplace, and the promise of next-generation PCMs designed to meet the constantly changing demands of the electronics industry.

Forum: SEMI-THERM – March 2015 event
Title: Phase Change Materials as an Alternative to Thermal Grease for Networking Applications
Description: This presentation features Phase Change Materials as an alternative to Thermal Grease for Networking Applications – a technical comparison. It was presented jointly by Juniper Networks and Honeywell Electronic Materials.

Forum: Chip Scale Review magazine, Nov/Dec 2014 publication
Title: Thermal Management Using Phase Change Materials
Description: Different classes of TIMs provide their own set of benefits and tradeoffs. This article explores advances in PCM technology that are overcoming such trade-offs, making it an attractive and proven thermal management solution for challenging applications.
Download pdf